What are your standard delivery terms for the wafer packaging system?

  • geo
  • 25-07-2026
  • 17

Standard delivery terms for the wafer packaging system require a twenty working day lead time after order confirmation. Shipping is available globally via sea, air, rail, road, or multimodal transport, with a minimum order quantity of one set. Payment terms follow a 100% TT or LC structure, requiring a 30% deposit and the remaining 70% balance paid before shipment.

Core Solutions & Key Takeaways

  • Hygienic and Gentle Product Handling: Engineered to process delicate creamed, sandwich, or chocolate-coated wafers without breakage, ensuring zero-defect sealing.
  • Automated Feeding and Alignment: Seamless integration of belt conveyors with side guides, vibratory tracks, and automated collating units to stack 2 to 6 wafers per pack.
  • Globally Certified Standards: Fully compliant with international safety regulations, backed by official CE certification for flow packaging machinery and automated systems.
  • Flexible Logistics and Operations: Supported by multiple shipping modes including FCL/LCL sea freight, rail freight, and road freight to accommodate different factory locations.

Detailed Architectural/Principle Analysis

The wafer automatic packaging system is designed using a continuous motion, horizontal form-fill-seal (HFFS) architecture. Wafers are fed into the system through a pre-packaging alignment module, where photoelectric sensors verify the positioning and dimensions of each product. Any misaligned or defective items are instantly detected and ejected by an automated rejection system to maintain packing speed and seal integrity.

High speed wafer flow packaging machine showing continuous motion sealing jaws

The core flow wrapping machinery utilizes a PLC-based master control architecture with distributed servo drives to synchronize the film feed, longitudinal preheating fin seal, and rotary cross-sealing jaws. The system processes heat-sealable laminates, such as OPP, CPP, and metallized films, to create hermetic pillow packs. Optional modules like modified atmosphere packaging (MAP) gas flushing can be integrated to replace internal oxygen with nitrogen, extending the shelf life of moisture-sensitive wafer products.

The entire product line meets global manufacturing regulations. The system holds CE certification (Certificate Number M.2024.206.C107511), validating its safety and operational standards for worldwide deployment. High-volume production reliability is demonstrated by cooperation cases with leading manufacturers like Orion, which has utilized 27 sets of specialized pie packaging systems across multiple plants to achieve stable, high-speed automated output with real-time digital monitoring.

CE certification document for flow packaging machine and automatic packaging system

Data/Solution Comparison

The wafer flow packaging machine is available in distinct configurations to suit different production capacities. The table below details the technical specifications across various standard model classes.

Model Class Speed (packs/min) Film Width Range (mm) Bag Length Range (mm) Servo Axes Main Application
Entry / Mini 30–90 90–280 60–200 2-Servo Artisan bakeries, small wafer biscuits
Mid-range 100–200 280–450 60–350 3-Servo Industrial wafer bars, creamed wafers
High-speed 200–350+ 450–900 80–400 4-Servo + Tension Control Mass production, multi-lane 24/7 operations

Frequently Asked Questions (FAQ)

What are the standard freight options for delivering complete packaging lines?

Large-scale integrated systems are primarily shipped via Sea Freight using Full Container Load (FCL) to ensure maximum safety. For inland destinations, Rail Freight is used, while Road Freight serves domestic and border crossings. Urgent spare parts and electronic control modules are shipped via Air Freight.

Does the system support different wafer packing configurations?

Yes. The pre-packaging module can be equipped with an automatic collating and stacking unit. This allows the system to stack and package between 2 to 6 wafers per individual pillow pack, with quick-changeover settings managed directly through the color touchscreen HMI.

What is the typical lead time for a custom wafer packaging line?

Standard configurations have a production delivery time of 20 working days. Highly customized turn-key lines that integrate upstream baking ovens or downstream robotic palletizing systems may require custom scheduling based on layout engineering requirements.

Final Conclusion & Recommendations

Selecting the right wafer flow packaging machine requires aligning factory output requirements with the appropriate servo drive architecture and sealing technology. Utilizing a 3-servo or 4-servo configuration ensures precise film tension control and reduces product waste during continuous high-speed runs. For detailed technical solutions or support, please reach out to us via lotuspack@ruipuhua-machinery.com.

About Us

Founded in 2005, Foshan Ruipuhua Machinery Equipment Co. Ltd is a manufacturer of intelligent packaging machinery. Operating from a 50,000-square-meter facility with 300 employees, the company integrates research, development, assembly, and service to provide automated packaging solutions. The factory maintains an annual production capacity exceeding 500 sets of automated systems, yielding an annual output value of approximately 300 million RMB.

Modern CNC machining and assembly facility for packaging machinery

The enterprise is CE certified and provides manufacturing and OEM business models to global markets. Its systems are deployed across various industries worldwide, serving global food brands such as Orion, Mondelez, Lay’s, and Bimbo.

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